The Taiwanese media report that Samsung is in the process
sourcing heat pipes designed for smartphones series
Galaxy S7 . They are taken into account apparently different concepts and
decision on the matter is still pending. This is to take place only
before the end of this month.
As we all know, the heart of the Galaxy S7 will be integrated Exynos
8890 and Snapdragon 820 . United processing power
It will be paid with quite a large evolution of heat .
Hence the idea of heat pipes securely to avoid possible
problems with overheating smartphones. How well
We know similar solution applied the Sony Xperia Z5
Premium , where Snapdragon 810 is also cooled
using heat pipes. In contrast, Microsoft decided to Lumii 950 XL
to cope with this processor and cooled it differently … the liquid.
Of course, the Samsung can not afford to slip-up with
przegrzewającymi to flagowcami, because it would reflect very negatively
at the image of a company that is a leader in the smartphone market.
According to information disclosed by the source shows that potential
supplier of heat pipes, when such a solution is selected,
will be informed about the planned deliveries later this
month.
Premieres’ Samsung Galaxy S7 expect during
Barcelona MWC 2016 trade fair, which will take place on 22-25
February.
In the video below you look at the guide, which
you will learn how to save flooded with phone
“See also:
Smartphone – Buyer’s Guide
Source: pclab
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